RO4360G2 2-Layer 32mil ENIG PCB for Base Station Amplifiers
1.Introduction of RO4360G2
Rogers RO4360G2 laminates are low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing capability. RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that can be processed similar to FR-4. These materials are lead-free process capable and offer better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs. RO4360G2 laminates can be paired with RO440 series prepreg and lower-Dk RO4000 laminate in multi-layer designs.
2.Key Features
High Dielectric Constant: 6.15 ±0.15 at 10 GHz/23°C
Low Loss Performance: Dissipation factor of 0.0038 at 10 GHz/23°C
High Temperature Performance: Td > 407°C, High Tg greater than 280°C TMA
Effective Thermal Management: High Thermal Conductivity of 0.75 W/mK
Excellent Reliability: Low Z-axis coefficient of thermal expansion at 28 ppm/°C
Dimensional Stability: Copper matched CTE X-axis 13 ppm/°C, Y-axis 14 ppm/°C (-55 to 288°C)
Modern Compliance: Lead free Process Compatible, 94V-0 flammability
3.Benefits
Design Versatility: Design flexibility for various applications
Enhanced Reliability: Plated through-hole reliability
Manufacturing Efficiency: Automated assembly compatible
Environmental Responsibility: Environmentally friendly - Lead free process compatible
Cost Effectiveness: Efficient supply chain and short lead times makes for cost effective material option
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO4360G2 |
| Layer Count | 2 layers |
| Board Dimensions | 73.12mm × 44.71mm = 1PC |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.30mm |
| Blind Vias | No |
| Finished Board Thickness | 0.9mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (12-Layer Rigid Structure)
Copper Layer 1 - 35 μm
Rogers RO4360G2 Substrate - 32mil (0.813mm)
Copper Layer 2 - 35 μm
6.PCB Statistics:
Components: 16
Total Pads: 53
Thru Hole Pads: 37
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 49
Nets: 2
7.Typical Applications
Base Station Power Amplifiers
Small Cell Transceivers
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
